Electronic Potting Compounds for water-proof

Electronic Potting Compound  for water-proof  Feature

Electronic Potting Compound is a kind of low viscosity, Inherent flame resistance; two components addition cured potting silicone with both room temperature and high temperature cured. The higher temperature is the faster cure it will be. It can be applied to electronic components for insulation, waterproofing, fixed and flame retardant. The European Union ROHS level can be achieved. 

Electronic Potting Compound  for water-proof Typical Application

Electronic Potting Compound is suitable for

- Precision Electronic Components, 

- DC/DC module and circuit board protection which requires high transparency and recovery.

Electronic Potting Compound  for water-proof Technical Guidelines

1 please put part A and part B in separate container and stir evenly before mixing the two parts together.

2 Mixing Ratio: part A: part B = 1:1 (By weight)

3 De-air the mixture in vacuum pump under 0.08 MPa for 3-5 minutes.

4 The temperature influences the curing time of HY-9300#. When under low temperature, we suggest to appropriately heat the mixture to accelerate vulcanization.

Suggestive operation time and temperature: Under temperature of 80~100, the silicone will cure in 15 minutes, while under 25C room temperature, the silicone will cure around 8 hours.