Condensation Cure Encapsulant

FOB Price

US $15.23100 - 40,000 kilogram

US $9.2140,001 - 999,999 kilogram

group name: electronic potting silicone rubber

Min Order: 100 kilogram

brand name: Hong Ye silicone rubber

model: HY-215

Nearest port for product export: Shenzhen, Guangzhou, Xiamen, Shanghai

Delivery clauses under the trade mode: FOB, CFR, CIF

Acceptable payment methods: T/T, L/C, Westem Union

Export mode: Export through agents

update time: Fri, 08 Nov 2013 19:26:36 GMT

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Paramtents

Appearance(liquid) black Liquid
Viscosity (25%)cps 2500±500
mixing ratio 10:1
Pot life (min) 20~30
Basic curing time (h) 3
Curing time(h) 24
Hardness ( Shore A°) 15±3
thermal conductivity (w/Mk) ≥0.4
Dielectric strength(kv/mm) ≥25
Dielectric constant (1.2MHz) 3.0~3.3

Packging & Delivery

Min Order100 kilogram

Briefing

it is mainly applied for the surface of polycarbonate, PP, ABS, PVC, metal etc.,

Detailed

Applications Condensation cure encapsulant HY-215 :

It is mainly applied for the surface of polycarbonate, PP, ABS, PVC, metal etc., which is suitable for the electronic moisture-proof and waterproof, fixed. It is applicable to sealing bonding coating LED for electronic parts.

Condensation Cure Encapsulant

Standard Datasheet Condensation cure encapsulant HY-215 :

Features		A	B
Curing agent	Appearance(liquid)	black Liquid	Clear or yellowish liquid
	Viscosity (25%)cps	2500±500
Operating performance	A,B mixing ratio	10:1
	Pot life (min)	20~30
	Basic curing time (h)	3
	Curing time(h)	24
	Hardness ( Shore A°)	15±3
After curing	thermal conductivity (w/Mk)	≥0.4
	Dielectric strength(kv/mm)	≥25
	Dielectric constant(1.2MHz)	3.0~3.3
	Volume resistance(Ω·cm)	≥1.0×10¹⁴
	Flame retardant	UL94V1

Condensation Cure Encapsulant

Features:

Condensation cure encapsulant and HY-215 is tow-component condensation cure silicone with the characteristics of low viscosity, easy pouring operation, good bonding feature. The safety of potting compound silicone can reach the EU-ROHS requirements fully.

Condensation Cure Encapsulant

Using instruction of Condensation cure encapsulant HY-215 :

1. First stir the Part A completely before using(to be sure the segiment is evenly mixted) to mixing the Part B as Part A.

2. Mix the Part A and Part B completely according to the mix ratio(10:1by weight) and can be used after deaired

3. this product can be vulcanized at room temperature. After basic curing then go to the next step. Full curing process will be within 24h.The enviromental temperature, especially the humidity, will affect the curing time greatly. Customers should make appropriate adjustments according to local conditions. The mixed silicone should be finished at one time to avoid any waste of material.

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