Electronic Potting Compound(silicone encapsulants)

FOB Price

US $20.86100 - 40,000 kilogram

US $14.9840,001 - 999,999 kilogram

group name: electronic potting silicone rubber

Min Order: 100 kilogram

brand name: Hong Ye silicone rubber

model: Electronic Potting Compound(silicone encapsulants)

Nearest port for product export: Shenzhen, Guangzhou, Xiamen, Shanghai

Delivery clauses under the trade mode: FOB, CFR, CIF

Acceptable payment methods: T/T, L/C, Westem Union

Export mode: Export through agents

update time: Fri, 08 Nov 2013 19:28:36 GMT

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Paramtents

Color black , gray , translucent
Certificate UL V94-0
Shape Pasty
Package Vacuum Pumping
Shelf Life 12 months
sample free
MOQ 200 KG
delivery within 3 days after payment
technical support free
payment terms T/T, L/C

Packging & Delivery

Min Order100 kilogram

Briefing

High powered electronics encapsulation
Easy Operation
Low Shrinkage
Large quantity offered
Free samples

Detailed

Electronic Potting Compound(silicone encapsulants)

1,Product Feature of Electronic Potting Compound(silicone encapsulants)

Electronic potting compound is a kind of low viscosity, Inherent flame resistance, two components (1:1mixing ratio)addtion cured potting silicone with heat-conducting. It cures with both on room temperature and heated temperature. It has the feature of the higher temperature the faster of the curing time. It can be applied to electronic components for insulation, waterproofing, fixed and flame retardant. It mainly applied in electronic components surface with materials of PC(Poly-carbonate),PP,ABS,PVC, etc. and metal materials.

Electronic Potting Compound(silicone encapsulants)

2,Typical Application of Electronic Potting Compound(silicone encapsulants)

-----High powered electronics encapsulation

-----DC/DC module and circuit board which requires heat dissipation and high temperature resistance.

-----It can be broadly used for LED screen, Wind Power Generator, PCB substrate, etc.

3,Standard datasheet(25 °C) of Electronic Potting Compound(silicone encapsulants):

Model		HY-9055			HY-9060		HY-9300		HY-9301
Appearance		Part A		Part B	Part A	Part B	Part A	Part B	A Part A	Part B
		Gray fluid		White fluid	Gray fluid	White fluid	Transparent	Transparent	Black	Transparent
Before Curing	Viscosisty(cP)	2500±200	2400±200		3000±500	2700±200	600 ± 200	800 ± 200	2500 ± 200	2300 ± 200
Operation Features	Part A:Part B (by weight)	1:1			1:1		1:1		1:1
	Mixed viscocity(cP)	2000~3000			2500-3500		600-1000		2000-3000
	Operation time(min)	120			120		180		300
	C Curing time(hrs,25°C)	8			8		8		8
	Curing time(min,80°C)	20			20		20		30
After Curing	Hardness( A)	55±5			55±5		0		0
	Thermal conductivity [W(m·K)]	≥0.8			≥0.8		≥0.2		≥0.3
	Dielectric Strength (KV/mm)	≥25			≥25		≥25		≥25
	Permittivity (1.2MHz)	3.0~3.3			3.0~3.3		3.0~3.3		3.0~3.3
	Volume Resisivity (Ω·cm)	≥1.0×10¹⁶			≥1.0×10¹⁶		≥1.0×10¹⁶		≥1.0×10¹⁶
	Linear expansibility [m/(m·K)]	≤2.2×10^-4			≤2.2×10^-4		≤2.2×10^-4		≤2.2×10^-4
	Fire Resistance	94-V1			94-V0		94-V1		94-V1

If you want to know more information abou tthe Electronic Potting Compound(silicone encapsulants) , please don't hesitate to contact with Miss Caroline at any time :

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