Electronic Potting Compound silicon

FOB Price

US $15.20100 - 40,000 kilogram

US $10.2040,001 - 999,999 kilogram

group name: electronic potting silicone rubber

Min Order: 100 kilogram

brand name: Hong Ye silicone rubber

model: HY 9055

Nearest port for product export: Shenzhen, Guangzhou, Xiamen, Shanghai

Delivery clauses under the trade mode: FOB, CFR, CIF

Acceptable payment methods: T/T, L/C, Westem Union

Export mode: Export through agents

update time: Sat, 09 Nov 2013 12:43:05 GMT

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Paramtents

color white/yellow/gray/red/blue

Packging & Delivery

Min Order100 kilogram

Briefing

HY 9055 is a kind of low viscosity, Inherent flame resistance, two components addtion cured potting silicone with heat-conducti

Detailed

Product Feature
HY 9055 is a kind of low viscosity, Inherent flame resistance, two components addtion cured potting silicon with heat-conducting. It cures with both on room temperature and heated temperature. It has the feature of the higher temperature the faster of the curing time. It can be applied to electronic components for insulation, waterproofing, fixed and flame retardant. It mainly applied in electronic components surface with materials of PC(Poly-carbonate),PP,ABS,PVC, etc. and metal materials.

Electronic Potting Compound silicon

Typical Application

HY 9055 could be applied to

- high powered electronics,

- DC/DC module and circuit board which requires heat dissipation and high temperature resistance.

-It can be broadly used for LED screen, Wind Power Generator, PCB substrate, etc.

Technical Parameters

Features		Part A	Part B
Before Curing	Appearence	Gray Fluid	White Fluid
	Viscosisty(25°Ccps)	2500±500	2500±500
Operation features	Mixing Ratio	1:1
	Viscosisty(after mixing) (cps)	2000~3000
	Operating Time(25°C hr)	120
	Curing time (min,25°C)	480
	Curing time(80°C hr)	20
After Curing	Hardness(Shore A)	55±5
	Thermal conductivity [W(m·K)]	≥0.8
	Dielectric Strength(KV/mm)	≥25
	Permittivity(1.2MHz)	3.0~3.3
	Volume Resisivity(Ω·cm)	≥1.0×1016
	linear expansibility [m/(m·K)]	≤2.2×10-4
	Fire Resistance	94-V1

(Pls note: the above data for this product in 25 °C temperature, 55 percent humidity conditions, for reference. The accurate data is measured by customers when using.)

TECHNICAL GUIDELINES

1, Pls put part A and part B in separate container and stir evenly before mixing the two part together.

2, Mixing Ratio: part A: part B = 1:1

3, Deaeration the mixture in vacuum pump under 0.08 MPa for 3-5 minutes.Then the mixture could be used for pouring.

4, Pls note that the thickness of the silicone affects the curing time. If the silicone used is a little thick,then the curing time will be a little longer.The temperature also affects the curing time.When in lower temperature, we suggest customers appropriately heat the mixture to accelerate vulcanization. With temperature of 80~100°C, the silicone will cure in 15 minutes; while in 25°C room temperature, the silicone will cure around 8 hours.

Electronic Potting Compound silicon

Notes:
1.The following material may hinder the curing of HY 9055, So pls use after the test. When necessary, pls clean the application areas.

l Organotin compound or Condensation silicone with organotin

l Sulphur, sulfide and sulfur rubber materials.

l Amine compounds as well as contains the amine materials.

l Pewters solder flux

2. HY 9055 should be sealed storage.The mixture should be used up disposably to avoid causing waste.

3. HY 9055 belongs to non-dangerous goods, but keep away from mouth and eyes.

4. When it gets stratified after a period of storage, Please mix it evenly before using,which does not affect the performance.